Providing the right solution with a cost savings to the customer
By Tom Hoffman, CEO/President
Semiconductors are fabricated on these thin silicon wafers, which come in various diameters (see the photo). The surface precision cannot be overemphasized. The chips built on them house millions of transistors. Yet, a typical microprocessor chip is no larger than a thumbnail. The technology mandates ultra-precision at every level, step and operation.
A key step in wafer preparation for the chemical diffusion and deposition operations of chip making is polishing.
Into this scenario comes our client with the coupling problem on their wafer polishing machines.
Design Challenges Ruled out Off-the-Shelf Solutions
Mandatory requirements included:
Hoffman engineers started with a standard coupling, and after re-designing all the components, provided the customer with a custom solution that met all requirements. It took only six weeks to arrive at the design pictured above. Using our well-developed multi-step design process, we were able to deliver working prototypes in just another four weeks.